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Proceedings Paper

Defect inspection using a high-resolution pattern image obtained from multiple low-resolution images of the same pattern on an observed noisy SEM image
Author(s): Masahiko Takashima; Yoshihiro Midoh; Koji Nakamae
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Paper Abstract

In this paper, we propose a novel defect inspection method by considering the advantage that the same pattern is repeatedly transferred onto a large number of areas in resist pattern fabrication. This approach consists of following two steps. The first step is to obtain a high-resolution pattern image from multiple low-resolution images of the same pattern on an observed noisy SEM image using a reconstruction-based super-resolution technique where the B-spline interpolation is utilized. It can reconstruct a high-resolution image from the low resolution and noisy images with a high degree of accuracy. The next step is to inspect defects by comparing the high-resolution pattern image with lowresolution images to be verified. We applied our method to model and SEM images to show its validity.

Paper Details

Date Published: 24 March 2008
PDF: 11 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 692216 (24 March 2008); doi: 10.1117/12.772513
Show Author Affiliations
Masahiko Takashima, Osaka Univ. (Japan)
Yoshihiro Midoh, Osaka Univ. (Japan)
Koji Nakamae, Osaka Univ. (Japan)


Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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