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Proceedings Paper

MAGIC: a European program to push the insertion of maskless lithography
Author(s): L. Pain; B. Icard; S. Tedesco; B. Kampherbeek; G. Gross; C. Klein; H. Loeschner; E. Platzgummer; R. Morgan; S. Manakli; J. Kretz; C. Holhe; K.-H. Choi; F. Thrum; E. Kassel; W. Pilz; K. Keil; J. Butschke; M. Irmscher; F. Letzkus; P. Hudek; A. Paraskevopoulos; P. Ramm; J. Weber
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Paper Abstract

With the willingness of the semiconductor industry to push manufacturing costs down, the mask less lithography solution represents a promising option to deal with the cost and complexity concerns about the optical lithography solution. Though a real interest, the development of multi beam tools still remains in laboratory environment. In the frame of the seventh European Framework Program (FP7), a new project, MAGIC, started January 1st 2008 with the objective to strengthen the development of the mask less technology. The aim of the program is to develop multi beam systems from MAPPER and IMS nanofabrication technologies and the associated infrastructure for the future tool usage. This paper draws the present status of multi beam lithography and details the content and the objectives of the MAGIC project.

Paper Details

Date Published: 28 March 2008
PDF: 12 pages
Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211S (28 March 2008); doi: 10.1117/12.772472
Show Author Affiliations
L. Pain, CEA-LETI, MINATEC (France)
B. Icard, CEA-LETI, MINATEC (France)
S. Tedesco, CEA-LETI, MINATEC (France)
B. Kampherbeek, MAPPER Lithography B. V. (Netherlands)
G. Gross, IMS Nanofabrication AG (Austria)
C. Klein, IMS Nanofabrication AG (Austria)
H. Loeschner, IMS Nanofabrication AG (Austria)
E. Platzgummer, IMS Nanofabrication AG (Austria)
R. Morgan, Synopsys, Inc. (United States)
S. Manakli, STMicroelectronics (France)
J. Kretz, Qimonda Dresden GmbH & Co. OHG (Germany)
C. Holhe, Qimonda Dresden GmbH & Co. OHG (Germany)
K.-H. Choi, Qimonda Dresden GmbH & Co. OHG (Germany)
F. Thrum, Qimonda Dresden GmbH & Co. OHG (Germany)
E. Kassel, KLA-Tencor Corp. (Israel)
W. Pilz, Fraunhofer Institut für Siliziumtechnologie (Germany)
K. Keil, Fraunhofer CNT (Germany)
J. Butschke, IMS Chips (Germany)
M. Irmscher, IMS Chips (Germany)
F. Letzkus, IMS Chips (Germany)
P. Hudek, Vorarlberg Univ. of Applied Sciences (Austria)
A. Paraskevopoulos, Fraunhofer Institute for Telecommunications, Heinrich-Hertz-Institute (Germany)
P. Ramm, Fraunhofer IZM Munich (Germany)
J. Weber, Fraunhofer IZM Munich (Germany)

Published in SPIE Proceedings Vol. 6921:
Emerging Lithographic Technologies XII
Frank M. Schellenberg, Editor(s)

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