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Proceedings Paper

UV-reflectometory for fast trench-depth measurement
Author(s): Masahiro Horie; Shuji Shiota; Shinji Yamaguchi; Kakumichi Yamano; Masayoshi Kobayashi
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Paper Abstract

The demands on optical metrology of etched structures continue to increase as microelectronics become more complex and use higher aspect ratios. We will show the ability of the Dainippon Screen trench measurement tool to measure linear trench device dimensions, such as trench depth, width monitoring, and mesa oxide thickness, with high precision and accuracy. The advantages of our tool are high throughput, cost effectiveness and ease of use, because of its optimization using an optical interference calculation. This tool used has demonstrated repeatability on the order of 3σ < 1 nm in Trench Depth and SiO2 thickness measurements.

Paper Details

Date Published: 25 March 2008
PDF: 8 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69223D (25 March 2008); doi: 10.1117/12.772425
Show Author Affiliations
Masahiro Horie, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Shuji Shiota, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Shinji Yamaguchi, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Kakumichi Yamano, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Masayoshi Kobayashi, Dainippon Screen Manufacturing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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