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Proceedings Paper

Film thickness measurement tool with a stress measurement function
Author(s): Masahiro Horie; Kumiko Akashika; Shuji Shiota; Shinji Yamaguchi; Kakumichi Yamano
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Paper Abstract

A shrinking design rule has decreased film thickness specifications and is creating challenges as multi-layer structures and new materials are introduced. We have developed a spectroscopic ellipsometer, the RE-5200, which can measure several parameters with spot sizes down to 30 um. The advantages of the RE-5200 include high long-term stability, high accuracy, short measurement time, and low COO. The high precision aspheric mirrors were developed specifically for this system and allow the measurement of very small areas on the device. In addition, the stress measurement function meets some of the latest demands, which are high throughput, high accuracy and pattern independent. This paper presents the optical design and performance of the RE-5200, including measurement results.

Paper Details

Date Published: 25 March 2008
PDF: 6 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 692235 (25 March 2008); doi: 10.1117/12.772416
Show Author Affiliations
Masahiro Horie, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Kumiko Akashika, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Shuji Shiota, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Shinji Yamaguchi, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Kakumichi Yamano, Dainippon Screen Manufacturing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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