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Proceedings Paper

Accurate model base verification scheme to eliminate hotspots and manage warmspots
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Paper Abstract

Lithography compliance check (LCC), which is verification of layouts using lithography simulation, is an essential step under the current low k1 lithography condition. However a conventional LCC scheme does not consider process proximity effect (PPE) differences among several manufacturing tools, especially for exposure tools. In this paper two concepts are proposed. One is PPE monitoring and matching using warmspots. The warmspots are patterns that have small process window. They are sensitive to difference of illumination conditions and are basically 2-dimensional patterns. The other is LCC using multiple simulation models that represent each PPE on exposure tools. All layouts are verified by these models and the layouts are fixed if hotspots (catastrophic failure on wafer) are found. This verification step is repeated until all hotspots are eliminated from the layouts. Based on these concepts, robust cell layouts that have no hotspot under the several PPE conditions are created.

Paper Details

Date Published: 18 March 2008
PDF: 8 pages
Proc. SPIE 6925, Design for Manufacturability through Design-Process Integration II, 69250Z (18 March 2008); doi: 10.1117/12.771856
Show Author Affiliations
Shigeki Nojima, Toshiba Corp. Semiconductor Co. (Japan)
Suigen Kyoh, Toshiba Corp. Semiconductor Co. (Japan)
Shimon Maeda, Toshiba Corp. Semiconductor Co. (Japan)
Soichi Inoue, Toshiba Corp. Semiconductor Co. (Japan)

Published in SPIE Proceedings Vol. 6925:
Design for Manufacturability through Design-Process Integration II
Vivek K. Singh; Michael L. Rieger, Editor(s)

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