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Improvements of adhesion and hydrophobicity of wafer bevel in water immersion lithography
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Paper Abstract

In this study, we focus on the controllability of a wafer bevel from adhesion and hydrophobicity viewpoints in order to solve the problems of film peeling and microdroplet formation around wafer bevels, which result in pattern defects. Hexamethyldisilazane (HMDS) treatment is a common solution to these problems. We examine a novel wafer bevel treatment utilizing silane coupling agents (SCAs) for obtaining high adhesion and hydrophobicity. SCAs comprise trimethoxysilanol and organic functional groups. These groups react with inorganic substrates and films just over the surface subjected to a novel chemical treatment (NCT), respectively. Several organic functional groups both with and without fluorine are examined. The hydrophobicity is estimated from the static and receding contact angles of water. The adhesion strength is measured from the stress required for pulling the topcoat film away from the substrate subjected to the NCT. The coating performance of chemicals on the surface by the NCT and the aging stability of the formulated solution of the SCAs are examined for optimizing the composition of the NCT solution. Further, we verify the film peeling behavior and water leakage in wafers having a topcoat, ArF resist, and bottom antireflective coating (BARC) using a quasi-immersion exposure stage.

Paper Details

Date Published: 26 March 2008
PDF: 8 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69231V (26 March 2008); doi: 10.1117/12.771794
Show Author Affiliations
Takeo Ishibash, Renesas Technology Corp. (Japan)
Mamoru Terai, Mitsubishi Electric Corp. (Japan)
Takuya Hagiwara, Renesas Technology Corp. (Japan)
Teruhiko Kumada, Mitsubishi Electric Corp. (Japan)
Tetsuro Hanawa, Renesas Technology Corp. (Japan)
Yoko Takebe, Asahi Glass Co., Ltd. (Japan)
Osamu Yokokoji, Asahi Glass Co., Ltd. (Japan)
Tomoharu Fujiwara, Nikon Corp. (Japan)
Hiroshi Akiyama, Nikon Corp. (Japan)

Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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