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Proceedings Paper

Effects of bake temperature and surface modifications on hardmask materials for trilayer applications
Author(s): Charles J. Neef; Jim Finazzo; Cheryl Nesbit; Michael Weigand
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Paper Abstract

A comparison of bake temperature effects on two hardmask materials was performed. The first hardmask was a silicon-based material, BSI.M06092K, and the second was a titanium-based material, BSI.S07051. The materials have inherently different chemistries that performed differently as bake temperature was varied. BSI.M06092K undergoes condensation of silanols on the wafer during baking and BSI.S07051 undergoes removal of the ligand followed by condensation during baking. In general, the performance of BSI.M06092K showed little or no dependency on bake temperature. BSI.S07051 showed an increase in contact angle with water, slower etch rates, and square profiles as bake temperature increased.

Paper Details

Date Published: 26 March 2008
PDF: 9 pages
Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 692331 (26 March 2008); doi: 10.1117/12.771701
Show Author Affiliations
Charles J. Neef, Brewer Science, Inc. (United States)
Jim Finazzo, Brewer Science, Inc. (United States)
Cheryl Nesbit, Brewer Science, Inc. (United States)
Michael Weigand, Brewer Science, Inc. (United States)


Published in SPIE Proceedings Vol. 6923:
Advances in Resist Materials and Processing Technology XXV
Clifford L. Henderson, Editor(s)

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