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Proceedings Paper

Industrial characterization of scatterometry for advanced APC of 65 nm CMOS logic gate patterning
Author(s): Karen Dabertrand; Mathieu Touchet; Stephanie Kremer; Catherine Chaton; Maxime Gatefait; Enrique Aparicio; Marco Polli; Jean-Claude Royer
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Paper Abstract

CMOS 65nm technology node requires the introduction of advanced materials for critical patterning operations. The study is focused on the multilayer Anti Reflective Coating (ARC) stack, used in photolithography, for the gate patterning such as Advanced Patterning Film (APF). The interest on this new and complex ARC stack lies in the benefit to guarantee low CD dispersion thanks to a better reflectivity control and resist budget which leads to a larger lithographic process window. However, it implies numerous metrology challenges. The paper deals with the challenges of monitoring the gate Critical Dimension (CD) on this stack. The validation of the scatterometry model versus stack thicknesses and indexes variations, through experiments, is also described. The final result is the complete characterization of the materials for thickness and scatterometry CD control, for photo feedback and for etch feed-forward deployment in an industrial mode. The analysis shows that scatterometry measurements on a standard 65 nm gate process ensure a better effectiveness than the CD Scanning Electron Microscopy (SEM) ones when injected in the Advanced Process Control (APC) system from photo to etch.

Paper Details

Date Published: 22 March 2008
PDF: 12 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69220W (22 March 2008); doi: 10.1117/12.771614
Show Author Affiliations
Karen Dabertrand, STMicroelectronics (France)
Mathieu Touchet, STMicroelectronics (France)
Stephanie Kremer, KLA-Tencor (France)
Catherine Chaton, CEA-LETI-Minatec (France)
Maxime Gatefait, STMicroelectronics (France)
Enrique Aparicio, STMicroelectronics (France)
Marco Polli, KLA-Tencor (France)
Jean-Claude Royer, CEA-LETI-Minatec (France)

Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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