
Proceedings Paper
Focus, dynamics, and defectivity performance at wafer edge in immersion lithographyFormat | Member Price | Non-Member Price |
---|---|---|
$14.40 | $18.00 |
![]() |
GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. | Check Access |
Paper Abstract
We evaluate several types of wafers and investigate the effect of wafer edge geometry on focus, dynamics and
defectivity performance in ArF immersion lithography. Wafer edge geometry includes both edge shape (e.g. short, long,
full round etc.) and edge roll-off (ERO) here. We found that focus accuracy at wafer edge depends on ERO, especially
on ZDD (Z double derivative) and if we use the specified wafer which has low ZDD value, it keeps same good focus
accuracy at the edge area as the one at the wafer center area. Dynamics (stage synchronization accuracy) was
independent of wafer diameter, thickness and edge geometry. We also found that defectivity was strongly dependent on
the edge shape. More bridging defects were found on the short edge wafer than the long edge wafer. This is related with
wafer edge conditions after coating and during exposure.
Paper Details
Date Published: 12 March 2008
PDF: 12 pages
Proc. SPIE 6924, Optical Microlithography XXI, 692419 (12 March 2008); doi: 10.1117/12.771598
Published in SPIE Proceedings Vol. 6924:
Optical Microlithography XXI
Harry J. Levinson; Mircea V. Dusa, Editor(s)
PDF: 12 pages
Proc. SPIE 6924, Optical Microlithography XXI, 692419 (12 March 2008); doi: 10.1117/12.771598
Show Author Affiliations
Published in SPIE Proceedings Vol. 6924:
Optical Microlithography XXI
Harry J. Levinson; Mircea V. Dusa, Editor(s)
© SPIE. Terms of Use
