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Proceedings Paper

A method for fabricating below 22nm feature patterns in quartz mold
Author(s): Atsunori Terasaki; Junichi Seki; Haruhito Ono
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Paper Abstract

In nanoimprint with UV curable resin, a mold fabricated by etching quartz by using Cr as a hard mask is generally used. For fine pattern fabrication, Cr fine pattern etching technology is very important. Usually, the realization of enough resolution needs a resist thickness reduction, which, however, makes it difficult to etch extremely fine Cr features with vertical sidewalls. Here, we propose a brand-new method called "reverse EB process". In this method, an electron-beam (EB) resist pattern is first reversed by a plasma-robust material, with which as a mask, the Cr is then etched to form a hard mask for the mold etching. By this process, we have realized a quartz mold with patterns of 16nm in half pitch at minimum.

Paper Details

Date Published: 20 March 2008
PDF: 9 pages
Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211N (20 March 2008); doi: 10.1117/12.771561
Show Author Affiliations
Atsunori Terasaki, Canon Inc. (Japan)
Junichi Seki, Canon Inc. (Japan)
Haruhito Ono, Canon Inc. (Japan)

Published in SPIE Proceedings Vol. 6921:
Emerging Lithographic Technologies XII
Frank M. Schellenberg, Editor(s)

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