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Proceedings Paper

Chip-to-chip optical link by using optical wiring method
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Paper Abstract

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (a) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (b) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (c) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. A chip-to-chip optical link system constructed with TRx modules was fabricated and the optical characteristics were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for vertical-cavity surface-emitting lasers (VCSELs) and photodiodes (PDs). We successfully achieved a 5 Gb/s data transmission rate with this optical link.

Paper Details

Date Published: 8 January 2008
PDF: 8 pages
Proc. SPIE 6801, Photonics: Design, Technology, and Packaging III, 68011M (8 January 2008); doi: 10.1117/12.770816
Show Author Affiliations
In-Kui Cho, Electronics and Telecommunications Research Institute (South Korea)
Seoung Ho Ahn, Electronics and Telecommunications Research Institute (South Korea)
Myung-Yung Jeong, Pusan National Univ. (South Korea)
Byung Sup Rho, Korea Photonics Technology Institute (South Korea)
Hyo Hoon Park, Information and Communications Univ. (South Korea)


Published in SPIE Proceedings Vol. 6801:
Photonics: Design, Technology, and Packaging III
Wieslaw Z. Krolikowski; Costas M. Soukoulis; Ping Koy Lam; Timothy J. Davis; Shanhui Fan; Yuri S. Kivshar, Editor(s)

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