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Proceedings Paper

Nanometric material removal using the electrokinetic phenomenon
Author(s): Leo Cheng Seng; Travis Lee Blackburn; Sum Huan Ng; Yang Chun; David Lee Butler; Steven Danyluk
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Paper Abstract

Material removal at the sub-micron level has been a topic of interest in the past few years, particularly with respect to the fabrication of miniaturized devices. While numerous techniques have been developed and refined from their larger mesoscale counterparts (e.g. microEDM, micromilling), most have inherent limitations such as tool dimensions restricting the minimum feature which can be produced. In this work, we are proposing a novel technique of using the electrokinetic phenomenon for precise material removal at rates in the order of nanometers/min. An AC electric field with a DC offset is applied to a flowing fluid containing suspended particles which will then collide with the workpiece material causing material wear and tear and thus material removal. Results showed that the technique was feasible in achieving sub-micron material removal in micro-channels up to a depth of several hundred nanometers. With no chemicals involved in the process, the technique offers the further attraction of being a benign nano-manufacturing process with potential usage in the biochip and microfluidics areas.

Paper Details

Date Published: 11 January 2008
PDF: 8 pages
Proc. SPIE 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV, 680028 (11 January 2008); doi: 10.1117/12.769686
Show Author Affiliations
Leo Cheng Seng, Nanyang Technological Univ. (Singapore)
Travis Lee Blackburn, Georgia Institute of Technology (United States)
Sum Huan Ng, Singapore Institute of Manufacturing Technology (Singapore)
Yang Chun, Nanyang Technological Univ. (Singapore)
David Lee Butler, Nanyang Technological Univ. (Singapore)
Singapore Institute of Manufacturing Technology (Singapore)
Steven Danyluk, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 6800:
Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV
Hark Hoe Tan; Jung-Chih Chiao; Lorenzo Faraone; Chennupati Jagadish; Jim Williams; Alan R. Wilson, Editor(s)

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