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Proceedings Paper

Experimental study on roughness and flatness of micromirror fabricated by different anisotropic silicon etching processes
Author(s): Jing Xu; Zhanxi Huang; Xiaoxin Xu; Yaming Wu
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Paper Abstract

Fabrication of flat, free-standing silicon diaphragms as micromirrors using etching processes is the key in the development of optical Micro-Elecro-Mechanical System(MEMS) devices, such as tunable F-P(Fabry-Perot) filters. It is very important for etching process to get smooth surface and uniform depth because they greatly affect the performance of the final device. In this paper, we report the experimental results about roughness and flatness of silicon micromirror fabricated by wet and dry etching processes. The investigated process involved wet-etching process in self-prepared KOH solution, and dry etching process with such machines as ALCATEL 601E DRIE(Deep Reactive Ion Etching) and STS ICP (Inductivity Coupling Plasma). It was found that wet etching process could supply more uniform etching depth, whereas the better surface roughness was gotten by dry etching. For a 30μm target depth, surface roughness less than 3-nm and maximal depth difference less than 0.3-μm were obtained by STS ICP and KOH respectively.

Paper Details

Date Published: 4 January 2008
PDF: 7 pages
Proc. SPIE 6836, MEMS/MOEMS Technologies and Applications III, 683605 (4 January 2008); doi: 10.1117/12.768487
Show Author Affiliations
Jing Xu, Shanghai Institute of Microsystem and Information Technology (China)
Zhanxi Huang, Graduate School of the Chinese Academy of Sciences (China)
Xiaoxin Xu, Graduate School of the Chinese Academy of Sciences (China)
Yaming Wu, Shanghai Institute of Microsystem and Information Technology (China)


Published in SPIE Proceedings Vol. 6836:
MEMS/MOEMS Technologies and Applications III
Jung-Chih Chiao; Xuyuan Chen; Zhaoying Zhou; Xinxin Li, Editor(s)

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