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Proceedings Paper

Full automatic packaging of a hybrid transceiver module
Author(s): Felix Frischkorn; Joern Miesner; Sebastian Glass
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Paper Abstract

System integrators are driven by the demands of hybrid module manufacturers to provide machines with a higher degree of system integration while maintaining full process automation at max. throughput and yield. The full automated packaging process involves Pick&Place of several components like photo diode, laser sub-mount, integrated optical chip and PCB. Whereby some components are placed passively supported by vision inspection and some are aligned actively by closing a control loop on nano-scale precision. The system applies adhesive bonding for fixation of the components. The presentation shows how various assembly steps are combined in one machine concept for assembling and qualifying complex hybrid modules. Therefore modern assembly machines relay to special hardware designs i.e. for trays, chucks, motion concepts and calibration systems as well as for software features as data base interfaces, recipe controlled processes and flexible process editor. However beside hardware and software feasibility also necessary device characterisation is an important feature in assembly machines.

Paper Details

Date Published: 8 February 2008
PDF: 5 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689908 (8 February 2008); doi: 10.1117/12.768353
Show Author Affiliations
Felix Frischkorn, ficonTEC GmbH (Germany)
Joern Miesner, ficonTEC GmbH (Germany)
Sebastian Glass, ficonTEC GmbH (Germany)


Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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