Share Email Print

Proceedings Paper

Silicon photonic integration for high-speed applications
Author(s): Ansheng Liu; Ling Liao; Doron Rubin; Juthika Basak; Yoel Chetrit; Hat Nguyen; D. W. Kim; Assia Barkai; Richard Jones; Nomi Elek; Rami Cohen; Nahum Izhaky; Mario Paniccia
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Photonic integration is one of the important ways to realize low cost and small form factor optical transceivers for future high-speed high capacity I/O applications in computing systems. The photonic integration on silicon platform is particularly attractive because of the CMOS photonics and electronics process compatibility. In this paper, we present design and fabrication of a silicon photonic integrated circuit that is capable of transmitting data at hundreds gigabits per second. In such an integrated chip, 8 high-speed silicon optical modulators with a 1:8 wavelength demultiplexer and an 8:1 wavelength multiplexer are fabricated on a single silicon-on-insulator (SOI) substrate. We review the recent results of individual silicon modulator based on electric-field-induced carrier depletion in a SOI waveguide containing a reverse biased pn junction. We characterize the individual multiplexer/demultiplexer as well as the integrated chip. The basic functionality of the photonic integration is demonstrated.

Paper Details

Date Published: 13 February 2008
PDF: 10 pages
Proc. SPIE 6898, Silicon Photonics III, 68980D (13 February 2008); doi: 10.1117/12.767561
Show Author Affiliations
Ansheng Liu, Intel Corp. (United States)
Ling Liao, Intel Corp. (United States)
Doron Rubin, Intel Corp. (Israel)
Juthika Basak, Intel Corp. (United States)
Yoel Chetrit, Intel Corp. (Israel)
Hat Nguyen, Intel Corp. (United States)
D. W. Kim, Intel Corp. (United States)
Assia Barkai, Intel Corp. (Israel)
Richard Jones, Intel Corp. (United States)
Nomi Elek, Intel Corp. (Israel)
Rami Cohen, Intel Corp. (Israel)
Nahum Izhaky, Intel Corp. (Israel)
Mario Paniccia, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 6898:
Silicon Photonics III
Joel A. Kubby; Graham T. Reed, Editor(s)

© SPIE. Terms of Use
Back to Top