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Proceedings Paper

Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond
Author(s): Petar Pepeljugoski; Mark Ritter; Jeffrey A. Kash; Fuad Doany; Clint Schow; Young Kwark; Lei Shan; Dong Kam; Xiaoxiong Gu; Christian Baks
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Paper Abstract

Aggregate chip bandwidths in server and high performance computing have exceeding Tb/s, and if present trends are to continue would lead to doubling the number of signal pins in each generation. For high bandwidth switch and server applications, bandwidth requirements could exceed the package pin limit as early as 2012. We defined metrics to compare the performance of electrical and optical interconnects, which includes bandwidth density (Gb/s/mm2/port), media bandwidth*distance product (GHz*m), power consumption (mW/Gb/s/Port), and technology comparison metric (Gb/s/mm2/port * GHz*m/mW/Port). We will show that optical interconnects offer a performance metric improvement factor of greater than 25 over electrical interconnects.

Paper Details

Date Published: 7 March 2008
PDF: 7 pages
Proc. SPIE 6897, Optoelectronic Integrated Circuits X, 68970I (7 March 2008); doi: 10.1117/12.766835
Show Author Affiliations
Petar Pepeljugoski, IBM T. J. Watson Research Ctr. (United States)
Mark Ritter, IBM T. J. Watson Research Ctr. (United States)
Jeffrey A. Kash, IBM T. J. Watson Research Ctr. (United States)
Fuad Doany, IBM T. J. Watson Research Ctr. (United States)
Clint Schow, IBM T. J. Watson Research Ctr. (United States)
Young Kwark, IBM T. J. Watson Research Ctr. (United States)
Lei Shan, IBM T. J. Watson Research Ctr. (United States)
Dong Kam, IBM T. J. Watson Research Ctr. (United States)
Xiaoxiong Gu, IBM T. J. Watson Research Ctr. (United States)
Christian Baks, IBM T. J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 6897:
Optoelectronic Integrated Circuits X
Louay A. Eldada; El-Hang Lee, Editor(s)

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