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Proceedings Paper

Connecting interface for modularization of digital microfluidics
Author(s): Hanping Yang; Shih-Kang Fan; Wensyang Hsu
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Paper Abstract

Here, interconnection technique to link digital microfluidic chips is proposed. Three kinds of digital microfluidic modules with connecting interface, including flexible module and two types of connector modules, are designed and fabricated. Since these modules are fabricated on a compliant polymer-based substrate (ITO PET), chip-to-chip droplet transportation even at different planes can be achieved by the proposed technique. A low-temperature fabrication process is developed for the polymer substrates, where the SU-8 acts as the insulator. Droplet transportation through electrowetting on curved surface is confirmed by testing on the bended flexible modules with different curvatures from 0 to 0.06 mm-1 at around 70 VAC. Then the droplet transportations between flexible and connector modules are investigated. It is found that the gap size between two modules and the sidewall profiles at interface affect the droplet transportation directly. For the gap size around 50μm with a smooth perpendicular sidewall profile, 80 VAC is shown to actuate droplet of 1.5 μl, 2.5 μl, or 3.5 μl to cross over the interface successfully.

Paper Details

Date Published: 13 February 2008
PDF: 12 pages
Proc. SPIE 6886, Microfluidics, BioMEMS, and Medical Microsystems VI, 68860L (13 February 2008); doi: 10.1117/12.765652
Show Author Affiliations
Hanping Yang, National Chiao Tung Univ. (Taiwan)
Shih-Kang Fan, National Chiao Tung Univ. (Taiwan)
Wensyang Hsu, National Chiao Tung Univ. (Taiwan)

Published in SPIE Proceedings Vol. 6886:
Microfluidics, BioMEMS, and Medical Microsystems VI
Wanjun Wang; Claude Vauchier, Editor(s)

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