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Proceedings Paper

Microstructures with rounded concave and sharp-edged convex corners in a single step wet anisotropic etching
Author(s): Prem Pal; Kazuo Sato; Miguel A. Gosalvez; Mitsuhiro Shikida
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Paper Abstract

This paper reports a wet anisotropic etching process for the fabrication of silicon MEMS structures with rounded concave and sharp convex corners on (100)-Si wafers. The process is developed using tetramethyl ammonium hydroxide (TMAH) at different concentrations (10, 20, 25 wt%) and a small amount (0.1% v/v) of non-ionic surfactant NC-200. The etching characteristics are measured on a silicon hemisphere and several Si(100) wafers at 60 °C. The hemisphere is used to observe the etching behavior of different crystallographic planes. The present work aims at minimizing the etch rates of non-(100) planes, so that microstructures with rounded concave corners and convex corners can be realized easily. The proposed anisotropic wet etching is used for the fabrication of different kinds of microfluidic channels. Conformal etching in a single step can be realized for arbitrary mask designs targeting 20-25 μm deep microstructures.

Paper Details

Date Published: 26 February 2008
PDF: 8 pages
Proc. SPIE 6882, Micromachining and Microfabrication Process Technology XIII, 68820F (26 February 2008); doi: 10.1117/12.765475
Show Author Affiliations
Prem Pal, Nagoya Univ. (Japan)
Kazuo Sato, Nagoya Univ. (Japan)
Miguel A. Gosalvez, Helsinki Univ. of Technology (Finland)
Mitsuhiro Shikida, Nagoya Univ. (Japan)


Published in SPIE Proceedings Vol. 6882:
Micromachining and Microfabrication Process Technology XIII
Mary-Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

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