Share Email Print
cover

Proceedings Paper

Integration of optical I/O with organic chip packages
Author(s): Christoph Berger; Laurent Dellmann; Peter Dill; Folkert Horst; Bert J. Offrein; Martin Schmatz; Stefano Oggioni; Mauro Spreafico; Giulio Macario
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

With the ongoing progress in chip scaling, the data flow to and from chip packages is increasing accordingly. The simultaneous increase of channel count and channel speed in an essentially constant form factor becomes a more and more demanding challenge. The resulting I/O-bottleneck is considered to be a major limiting factor for the overall performance of future chip packages and computing systems. Optical interconnects offer both increased channel density as well as longer link reach at high frequencies. Our current work focuses on integrating optical I/O with standard organic packages in order to maximize the aggregate data flow to and from such packages. We present a novel approach for attaching an electro-optical conversion module directly on top of the organic chip package, together with experimental results of a first prototype implementation.

Paper Details

Date Published: 8 February 2008
PDF: 9 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689912 (8 February 2008); doi: 10.1117/12.764844
Show Author Affiliations
Christoph Berger, IBM Research GmbH (Switzerland)
Laurent Dellmann, IBM Research GmbH (Switzerland)
Peter Dill, IBM Research GmbH (Switzerland)
Folkert Horst, IBM Research GmbH (Switzerland)
Bert J. Offrein, IBM Research GmbH (Switzerland)
Martin Schmatz, IBM Research GmbH (Switzerland)
Stefano Oggioni, IBM Italy (Italy)
Mauro Spreafico, IBM Italy (Italy)
Giulio Macario, IBM Italy (Italy)


Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top