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Proceedings Paper

Assembly of optical MUX/DEMUX on silicon optical bench with high placement accuracies
Author(s): Chee Wei Tan; Teck Guan Lim; Jing Li; Geri Endrio Tangdiongga; Yi Yoon Chai; Seiji Maruo; Pamidighantam V. Ramana; Seung Wook Yoon; John H. Lau
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Paper Abstract

An optical sub-assembly of MUX/DEMUX where optical devices are hybrid-integrated on a silicon optical bench (SiOB) using a low cost passive alignment method was reported. A tight tolerance of positional and tilting angular accuracy is required for optical devices attachment in order to maximize the coupling efficiency. The critical positioning transverse to the optical axis merely depends on the symmetry, and accuracy of the position and shape of trenches. Any inaccuracy primarily affects the non-critical positioning, i.e., z-axis & θz, in the direction along the optical axis; misalignment accumulated and causes undesired insertion loss. All the piece parts, i.e., mirror, thin-film filters (TFFs), ball lens, SiOB etc., have a defined tolerance in their dimensions and surfaces which increases the challenge in achieving high placement accuracy along the optical axis. The effects from these inherent inaccuracies of the position and shape of trenches and piece parts could be minimized by improve the bottom flatness, and proper procedure selection. Misalignment at each axis, e.g. x-, y-, z-, θx, θy & θz was characterized and its effect to the coupling efficiency was discussed.

Paper Details

Date Published: 8 February 2008
PDF: 8 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990N (8 February 2008); doi: 10.1117/12.764242
Show Author Affiliations
Chee Wei Tan, A*STAR (Singapore)
Teck Guan Lim, A*STAR (Singapore)
Jing Li, A*STAR (Singapore)
Geri Endrio Tangdiongga, A*STAR (Singapore)
Yi Yoon Chai, A*STAR (Singapore)
Seiji Maruo, Hitachi Cable Ltd. (Japan)
Pamidighantam V. Ramana, A*STAR (Singapore)
Seung Wook Yoon, A*STAR (Singapore)
John H. Lau, A*STAR (Singapore)

Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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