Share Email Print

Proceedings Paper

Low-cost high-density optical parallel link modules and optical backplane for the last 1-meter regime applications
Author(s): Takashi Mikawa
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We describe our R & D on optoelectronic packaging technologies such as the optical backplane utilizing 300 pieces of the high index contrast fine multimode fibers and the low-cost and high-density OE-conversion parallel link modules operating at 10 Gbps /ch for less than 1 m regime applications. Combination of the developed backplane and the modules implies potential of 3 Tbps aggregate throughputs at the board-to-board level optical interconnections. We also introduce novel component technologies for low-cost and high-density optical coupling between optical devices. These technologies include the monolithic two wavelengths twin VCSELs and easy self-alignment coupling technology capable of alleviating difficulties for optics penetration inside the box.

Paper Details

Date Published: 6 February 2008
PDF: 10 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689902 (6 February 2008); doi: 10.1117/12.764197
Show Author Affiliations
Takashi Mikawa, National Institute of Advanced Industrial Science and Technology (Japan)

Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top