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Proceedings Paper

Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices
Author(s): Robert Miller; Daming Liu; Michael Horsinka; Touyen Nguyen; Kiran Kuppuswamy; Terrance Towe; Hanxuan Li; Myra Berube; James Harrison; Edmund Wolak
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Paper Abstract

Here we present characteristic performance of laser-diode devices employing a novel CTE-matched heatsink technology (where CTE is Coefficient of Thermal Expansion). Design variants of the composite-copper platforms include form-fit-compatible versions of production CS (for standard 1-cm-wide bars) and CT (for single-emitter devices and mini-bars) assemblies. Both employ single-step AuSn bonding and offer superior thermal performance to that of current production standards. These attributes are critical to reliability at high powers in both CW and hard-pulse (e.g., 1sec on/1sec off) operation. The superior thermal performance of the composite-copper CS device has been verified in CW testing of bars where 85W is typically obtained at 95A (compared to 76W from production-standard, indium-bonded, solid-copper CS devices). This result is especially significant as alternative CTE-matched bar platforms (e.g., those employing a sub-mount bonded to a solid copper heatsink) typically compromise the effective thermal resistance in order to achieve the CTE match (and often require two-step bonding). The close CTE match of the composite-copper CS results in relatively narrow, single-peaked spectra. Initial step stress tests of eight devices in hard-pulse operation up to 80A has been completed with no observed failures. Six of these devices have subsequently been operated in hard-pulse mode at 55A for >4000 with no failures. The CT variant of the composite-copper heatsink is predicted to offer a reduction in thermal resistance of nearly 30% for a 5-emitter mini-bar (500-μm pitch). In first-article testing, the maximum achievable CW power increased from 20W (standard CuW CT) to 24W (composite-copper CT). As with the CS devices, the composite-copper CT assemblies exhibited characteristically narrower spectral profiles.

Paper Details

Date Published: 13 February 2008
PDF: 8 pages
Proc. SPIE 6876, High-Power Diode Laser Technology and Applications VI, 687607 (13 February 2008); doi: 10.1117/12.764087
Show Author Affiliations
Robert Miller, Spectra-Physics Lasers (United States)
Daming Liu, Spectra-Physics Lasers (United States)
Michael Horsinka, Spectra-Physics Lasers (United States)
Touyen Nguyen, Spectra-Physics Lasers (United States)
Kiran Kuppuswamy, Spectra-Physics Lasers (United States)
Terrance Towe, Spectra-Physics Lasers (United States)
Hanxuan Li, Spectra-Physics Lasers (United States)
Myra Berube, Spectra-Physics Lasers (United States)
James Harrison, Spectra-Physics Lasers (United States)
Edmund Wolak, Spectra-Physics Lasers (United States)


Published in SPIE Proceedings Vol. 6876:
High-Power Diode Laser Technology and Applications VI
Mark S. Zediker, Editor(s)

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