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Proceedings Paper

Design and analysis of 3D stacked optoelectronics on optical printed circuit boards
Author(s): John H. Lau; Ying Ying Lim; Teck Guan Lim; Gong Yue Tang; Chee Houe Khong; Xiaowu Zhang; Pamidighantam V. Ramana; Jing Zhang; Chee Wei Tan; Jayakrishnan Chandrappan; Joey Chai; Jing Li; Geri Tangdiongga; Dim Lee Kwong
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Paper Abstract

In this study, a low-cost (with bare chips) and high (optical, electrical, and thermal) performance optoelectronic system with a data rate of 10Gbps is designed and analyzed. This system consists of a rigid printed circuit board (PCB) made of FR4 material with an optical polymer waveguide, a vertical cavity surface emitted laser (VCSEL), a driver chip, a 16:1 serializer, a photo-diode detector, a Trans-Impedance Amplifier (TIA), a 1:16 deserializer, and heat spreaders. The bare VCSEL, driver chip, and serializer chip are stacked with wire bonds and then solder jointed on one end of the optical polymer waveguide on the PCB via Cu posts. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are stacked with wire bonds and then solder jointed on the other end of the waveguide on the PCB via Cu posts. Because the devices in the 3D stacking system are made with different materials, the stresses due to the thermal expansion mismatch among various parts of the system are determined.

Paper Details

Date Published: 8 February 2008
PDF: 20 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689907 (8 February 2008); doi: 10.1117/12.764032
Show Author Affiliations
John H. Lau, Institute of Microelectronics (Singapore)
Ying Ying Lim, Institute of Microelectronics (Singapore)
Teck Guan Lim, Institute of Microelectronics (Singapore)
Gong Yue Tang, Institute of Microelectronics (Singapore)
Chee Houe Khong, Institute of Microelectronics (Singapore)
Xiaowu Zhang, Institute of Microelectronics (Singapore)
Pamidighantam V. Ramana, Institute of Microelectronics (Singapore)
Jing Zhang, Institute of Microelectronics (Singapore)
Chee Wei Tan, Institute of Microelectronics (Singapore)
Jayakrishnan Chandrappan, Institute of Microelectronics (Singapore)
Joey Chai, Institute of Microelectronics (Singapore)
Jing Li, Institute of Microelectronics (Singapore)
Geri Tangdiongga, Institute of Microelectronics (Singapore)
Dim Lee Kwong, Institute of Microelectronics (Singapore)

Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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