Share Email Print
cover

Proceedings Paper

Next-generation microchannel coolers
Author(s): Ryan Feeler; Jeremy Junghans; Greg Kemner; Ed Stephens
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A next-generation microchannel cooler has been developed for packaging laser diode arrays that eliminates many of the problems associated with typical copper-based cooling designs. The coolers are built on well-established Low-Temperature Cofired Ceramic technology and provide excellent thermal performance. They do not require the use of deionized water. This work highlights the strengths of the new cooler technology. The results of a long-term, high-flow-rate test which demonstrates the excellent erosion resistance of these coolers are presented. Three devices have been tested for 2500 hours at a flow rate of 0.25 GPM and show minimal signs of erosion. This data is compared to a similar test conducted with copper coolers. Several design parameters are also addressed for the ceramic coolers. The available form and fit characteristics are addressed, as is the custom-configurable nature of the devices.

Paper Details

Date Published: 13 February 2008
PDF: 8 pages
Proc. SPIE 6876, High-Power Diode Laser Technology and Applications VI, 687608 (13 February 2008); doi: 10.1117/12.763898
Show Author Affiliations
Ryan Feeler, Northrop Grumman Cutting Edge Optronics (United States)
Jeremy Junghans, Northrop Grumman Cutting Edge Optronics (United States)
Greg Kemner, Northrop Grumman Cutting Edge Optronics (United States)
Ed Stephens, Northrop Grumman Cutting Edge Optronics (United States)


Published in SPIE Proceedings Vol. 6876:
High-Power Diode Laser Technology and Applications VI
Mark S. Zediker, Editor(s)

© SPIE. Terms of Use
Back to Top