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Proceedings Paper

Precision laser processing for micro electronics and fiber optic manufacturing
Author(s): Andrew Webb; Mike Osborne; Gideon Foster-Turner; Duane W. Dinkel
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Paper Abstract

The application of laser based materials processing for precision micro scale manufacturing in the electronics and fiber optic industry is becoming increasingly widespread and accepted. This presentation will review latest laser technologies available and discuss the issues to be considered in choosing the most appropriate laser and processing parameters. High repetition rate, short duration pulsed lasers have improved rapidly in recent years in terms of both performance and reliability enabling flexible, cost effective processing of many material types including metal, silicon, plastic, ceramic and glass. Demonstrating the relevance of laser micromachining, application examples where laser processing is in use for production will be presented, including miniaturization of surface mount capacitors by applying a laser technique for demetalization of tracks in the capacitor manufacturing process and high quality laser machining of fiber optics including stripping, cleaving and lensing, resulting in optical quality finishes without the need for traditional polishing. Applications include telecoms, biomedical and sensing. OpTek Systems was formed in 2000 and provide fully integrated systems and sub contract services for laser processes. They are headquartered in the UK and are establishing a presence in North America through a laser processing facility in South Carolina and sales office in the North East.

Paper Details

Date Published: 22 February 2008
PDF: 13 pages
Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 688003 (22 February 2008); doi: 10.1117/12.763667
Show Author Affiliations
Andrew Webb, OpTek Systems Inc. (United States)
Mike Osborne, OpTek Systems Inc. (United States)
Gideon Foster-Turner, OpTek Systems Inc. (United States)
Duane W. Dinkel, OpTek Systems Inc. (United States)

Published in SPIE Proceedings Vol. 6880:
Laser-based Micro- and Nanopackaging and Assembly II
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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