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Proceedings Paper

Design, fabrication, and integration of HIC glass waveguides on a silicon platform
Author(s): Juejun Hu; Nathan Carlie; Ning-Ning Feng; Laeticia Petit; Anu Agarwal; Kathleen Richardson; Lionel Kimerling
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Paper Abstract

We demonstrate Si-CMOS-compatible lift-off fabrication of chalcogenide glass waveguides monolithically integrated on a silicon platform. As a novel route of glass film patterning, lift-off allows several benefits: leverage with Si-CMOS process compatibility; ability to fabricate single-mode waveguides with core sizes down to submicron range; reduced sidewall roughness; and wide applicability to other non-silica glass compositions. High-index-contrast (HIC) single-mode strip waveguides have been fabricated with from several glass target compositions including Ge23Sb7S70, As2S3, As36Ge6S58, As36Sb6S58 and TeO2. We measured Ge-Sb-S waveguides with low loss and excellent wafer-scale uniformity. We have experimentally demonstrated propagation loss reduction via graded-index (GRIN) cladding layers in HIC glass waveguides. These efforts have shown that scattering loss arising from sidewall roughness can be significantly reduced without compromising the high-index-contrast condition by inserting thin GRIN cladding layers with refractive indices intermediate between the core and topmost cover of a strip waveguide.

Paper Details

Date Published: 12 February 2008
PDF: 8 pages
Proc. SPIE 6896, Integrated Optics: Devices, Materials, and Technologies XII, 68960Z (12 February 2008); doi: 10.1117/12.763588
Show Author Affiliations
Juejun Hu, Massachusetts Institute of Technology (United States)
Nathan Carlie, Clemson Univ. (United States)
Ning-Ning Feng, Massachusetts Institute of Technology (United States)
Laeticia Petit, Clemson Univ. (United States)
Anu Agarwal, Massachusetts Institute of Technology (United States)
Kathleen Richardson, Clemson Univ. (United States)
Lionel Kimerling, Massachusetts Institute of Technology (United States)


Published in SPIE Proceedings Vol. 6896:
Integrated Optics: Devices, Materials, and Technologies XII
Christoph M. Greiner; Christoph A. Waechter, Editor(s)

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