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Proceedings Paper

Electro-optical circuit boards using thin-glass sheets with integrated optical waveguides
Author(s): Axel Beier; Henning Schröder; Norbert Arndt-Staufenbiel; Frank Ebling; Martin Franke; Elmar Griese; Steffan Intemann; Jan Kostelnik; Thomas Kühler; Roland Mödinger; Ingo Roda; Ingolf Schlosser
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Paper Abstract

The following paper presents research on the manufacture of circuit boards with buried optical waveguides using thin-glass sheets (display glass), which represents a further development of earlier research on buried optical waveguide substrates using polymer. An ion-exchange process was developed to manufacture the waveguides in thin-glass sheets, thereby eliminating the necessity of mechanically structuring the layers. The waveguide properties were simulated and experimentally validated. The circuit board assembly and the concept for the optical coupling from the module to the board and from the board to the backplane are presented. The design and assembly of pluggable electro-optical transmitter and receiver modules is described.

Paper Details

Date Published: 8 February 2008
PDF: 12 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990X (8 February 2008); doi: 10.1117/12.763180
Show Author Affiliations
Axel Beier, Siemens AG (Germany)
Henning Schröder, Fraunhofer IZM (Germany)
Norbert Arndt-Staufenbiel, Fraunhofer IZM (Germany)
Frank Ebling, Würth Elektronik GmbH & Co. KG (Germany)
Martin Franke, Siemens AG (Germany)
Elmar Griese, Univ. Siegen (Germany)
Steffan Intemann, U-L-M Photonics GmbH (Germany)
Jan Kostelnik, Würth Elektronik GmbH & Co. KG (Germany)
Thomas Kühler, Univ. Siegen (Germany)
Roland Mödinger, Erni Elektroapparate GmbH (Germany)
Ingo Roda, Univ. Siegen (Germany)
Ingolf Schlosser, AEMtec GmbH (Germany)

Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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