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Proceedings Paper

Optoelectronic packaging based on laser joining
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Paper Abstract

Laser based joining technologies for optical assemblies overcome the limitations of standard fixation technologies such as adhesive or wafer level bonding. By applying the laser energy locally and for a limited time these technologies enable for higher stability of optical joints as well as additional functionality. Working without intermediate layers laser splicing creates highly stable transparent joints that are suitable for the transmission of high power, e.g. in fiber laser assemblies. In contrast, laser beam soldering of optical components as an alternative with a metallic intermediate layer is non-transparent, but creates flexible and stress-compensating joints as well as thermal and electrical interconnects.

Paper Details

Date Published: 23 February 2008
PDF: 10 pages
Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800G (23 February 2008); doi: 10.1117/12.763105
Show Author Affiliations
Ramona Eberhardt, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Erik Beckert, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Thomas Burkhardt, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Steffen Böhme, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Thomas Schreiber, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Andreas Tünnermann, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)


Published in SPIE Proceedings Vol. 6880:
Laser-based Micro- and Nanopackaging and Assembly II
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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