Share Email Print
cover

Proceedings Paper

Sensitivity and stress effects of composite membranes with micro/macro porous silicon for pressure sensor applications
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Since porous silicon (PS) has a lower Young's Modulus as compared to silicon, Silicon/Porous Silicon (Si/PS) composite membranes are expected to show higher sensitivity as compared to membranes of silicon alone. In this paper we discuss the fabrication and testing of Si/PS composite membranes where a part of the silicon membrane depth is converted into PS. Composite membranes with Si/ microPS and Si/ macroPS were fabricated with varying porosity and same thickness. The composite membranes with micro PS show higher sensitivity than composite membranes with macro PS. Formation of microporous and macroporous silicon produces stress on the membrane varying with the porosity. The variation in compressive stress on the membrane with porosity for both micro and macro PS has been studied by measuring the deformation of the composite membrane with a surface profiler and the stress is found to be larger for microPS. The compressive stress results in an increase in the offset voltage by more than an order of magnitude for composite membranes with porosity above 50% as compared to one with a single crystalline silicon one. Though the composite membranes exhibit saturation and hysteresis at higher pressures, the response is linear and repeatable at pressures below 1 bar making this a viable option for sensing low pressures.

Paper Details

Date Published: 26 February 2008
PDF: 7 pages
Proc. SPIE 6882, Micromachining and Microfabrication Process Technology XIII, 68820H (26 February 2008); doi: 10.1117/12.762868
Show Author Affiliations
L. Sujatha, Indian Institute of Technology Madras (India)
Enakshi Bhattacharya, Indian Institute of Technology Madras (India)


Published in SPIE Proceedings Vol. 6882:
Micromachining and Microfabrication Process Technology XIII
Mary-Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

© SPIE. Terms of Use
Back to Top