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Proceedings Paper

Surface mount optical interconnects
Author(s): Edward Palen
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Paper Abstract

New surface mount optical coupling solutions for short reach and chip level connection are presented. These miniaturized optical interconnects have advanced micro-optics integrated within fiber connectors, chips and light sources. Interconnect fabrication is compatible with Si CMOS processing, III-V processing and automated surface mount assembly processing. The combination of these fabrication and assembly processing methods enable dramatic cost reductions for optical interconnects.

Paper Details

Date Published: 8 February 2008
PDF: 5 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990B (8 February 2008); doi: 10.1117/12.762313
Show Author Affiliations
Edward Palen, PalenSolutions Consulting (United States)

Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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