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Proceedings Paper

Enhanced microchannel cooling for high-power semiconductor diode lasers
Author(s): Joe Dix; Amir Jokar; Robert Martinsen
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Paper Abstract

The power consumption of semiconductor diode laser bars has continually increased in recent years while the heat transfer area for rejecting the associated thermal energy has decreased. As a result, the generated heat fluxes have become more intense making the thermal management of the laser systems more complicated. A common solution to this problem is to use the microchannel cooler, a small liquid enhanced heat sink capable of rejecting heat fluxes higher than those of finned air sinks of comparable size. The objective of this study is to improve and enhance heat transfer through an existing microchannel cooler using the computational fluid dynamics technique. A commercial software package is used to simulate fluid flow and heat transfer through the existing microchannel cooler, as well as to improve its designs. Three alternate microchannel designs are explored, all with hydraulic diameters on the order of 300 microns. The resulting temperature profiles within the microchannel cooler are analyzed for the three designs, and both the heat transfer and pressure drop performances are compared. The optimal microchannel cooler is found to have a thermal resistance of about 0.07°C-cm2/W and a pressure drop of less than half of a bar.

Paper Details

Date Published: 13 February 2008
PDF: 10 pages
Proc. SPIE 6876, High-Power Diode Laser Technology and Applications VI, 687606 (13 February 2008); doi: 10.1117/12.762172
Show Author Affiliations
Joe Dix, Washington State Univ./Vancouver (United States)
Amir Jokar, Washington State Univ./Vancouver (United States)
Robert Martinsen, nLight Photonics (United States)


Published in SPIE Proceedings Vol. 6876:
High-Power Diode Laser Technology and Applications VI
Mark S. Zediker, Editor(s)

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