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Proceedings Paper

Laser direct writing of SiO2/TiO2 sol-gel films to fabricate stripe optical waveguides
Author(s): Xiaoyan Zeng; Aikui Li; Zemin Wang; Jiajun Liu; Chunxia Wang; Hongda Chen
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Paper Abstract

SiO2-TiO2 planar optical waveguides are fabricated on silicon wafer substrate by dip-coating technique with the Sol-Gel solutions, based on which the stripe optical waveguides are patterned by laser direct writing of the Sol-Gel films using an Ytterbium fiber laser and followed by chemical etching. The effects of the laser processing parameters on the microstructure of the core layer films are investigated. The relative chemical etching rates of the non-irradiated area in Sol-Gel films that are haeted at different temperature are characterized. The optical fields and propagation losses of the optical waveguides at the wavelength of 1550 nm are characterized by multi-channel fiber/waveguides coupling system. The experimental results demonstrate that the composition, the post heat treatment temperature and laser power density have a big effect on the widths of the stripe optical waveguides, and the minimum widths about 25 μm can be fabricated with the suitable parameters. The core layer of the planar optical waveguides as received by Sol-Gel method is loose in structure, and a shrinkage concave groove forms in the laser irradiated area. The microstructure and forming mechanisms of the stripe waveguides by laser direct writing Sol-Gel films are discussed. The minimum propagation loss of the fabricated stripe waveguides is about 1.77dB/cm at 1550nm. Better results are expected by improving the film composition and laser processing parameters further.

Paper Details

Date Published: 23 February 2008
PDF: 11 pages
Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800Q (23 February 2008); doi: 10.1117/12.762107
Show Author Affiliations
Xiaoyan Zeng, Huazhong Univ. of Science and Technology (China)
Aikui Li, Huazhong Univ. of Science and Technology (China)
Zemin Wang, Huazhong Univ. of Science and Technology (China)
Jiajun Liu, Huazhong Univ. of Science and Technology (China)
Chunxia Wang, Institute of Semiconductors (China)
Hongda Chen, Institute of Semiconductors (China)

Published in SPIE Proceedings Vol. 6880:
Laser-based Micro- and Nanopackaging and Assembly II
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

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