Share Email Print
cover

Proceedings Paper

Laser micromachining of branching networks
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We describe maskless rapid prototyping of a micro-fluidic branching network on a silicon wafer with laser direct writing (LDW). The branching micro-channel network is designed as a blood oxygenator following Murray's law and satisfying the necessity of equal path lengths. In development of such micro-fluidic structures, this maskless process will reduce time and cost compared with the conventional photolithography based technique. The flexibility of laser direct writing facilitates creating a multi-depth structure of the branching network, ranging from a few microns to a few hundred microns in depth. In order to create such a wide range of feature sizes, a nanosecond pulsed Nd-YAG laser and a femtosecond pulsed fiber laser are used together. The femtosecond fiber laser is used to create micro-channels with a depth of less than 50μm. As post-processing, a chemical etching in a solution of HF and HNO3 is applied to smooth the laser ablated surface. To realize an optimized design of micro-fluidic structures, influences of operating parameters, such as the pulse energy, the focal position, the transverse speed, and the number of passes, on the depth of micro-channels and their surface quality are investigated. Using the laser machined silicon structures as a mold, a Poly(dimethylsiloxane) (PDMS) replica is created.

Paper Details

Date Published: 23 February 2008
PDF: 8 pages
Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800S (23 February 2008); doi: 10.1117/12.761821
Show Author Affiliations
DongHyuck Kam, Univ. of Michigan (United States)
Lawrence Shah, IMRA America, Inc. (United States)
Jyotirmoy Mazumder, Univ. of Michigan (United States)


Published in SPIE Proceedings Vol. 6880:
Laser-based Micro- and Nanopackaging and Assembly II
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Willem Hoving; Jun Amako, Editor(s)

© SPIE. Terms of Use
Back to Top