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Proceedings Paper

Uncooled amorphous silicon 160 x 120 IRFPA with 25 um pixel-pitch for large volume applications
Author(s): M. Vilain; J. L. Tissot; O. Legras; J. J. Yon; C. Minassian; B. Fièque; J. M. Chiappa
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Paper Abstract

This paper reviews the specifications and performances of a 160 × 120 uncooled infrared focal plane array made from amorphous silicon microbolometers with a pixel-pitch of 25 μm, integrated into a LCC TEC-less package. This detector has been specifically designed for large volume production, while keeping the main features of high end developments, at detection pixel level, as well as at ROIC level, like detector configuration by serial link in order to minimize the number of electrical inputs, low power, large dynamic range...) The main particular features of this achievement are the miniaturized very low weight package, along with easy TEC-less operation naturally afforded via the readout architecture, which leads to very low consumption levels, making it well adapted to low end hand held or helmet mounted thermal imaging cameras. We present in the last part of this paper the main electro-optical characteristics and TEC-less operation, demonstrating wide thermal dynamic range and low power, thanks to the simple single-level amorphous silicon technology, coupled with advanced ROIC design.

Paper Details

Date Published: 24 January 2008
PDF: 7 pages
Proc. SPIE 6835, Infrared Materials, Devices, and Applications, 68350F (24 January 2008); doi: 10.1117/12.760900
Show Author Affiliations
M. Vilain, ULIS (France)
J. L. Tissot, ULIS (France)
O. Legras, ULIS (France)
J. J. Yon, CEA-LETI (France)
C. Minassian, ULIS (France)
B. Fièque, ULIS (France)
J. M. Chiappa, ULIS (France)

Published in SPIE Proceedings Vol. 6835:
Infrared Materials, Devices, and Applications
Yi Cai; Haimei Gong; Jean-Pierre Chatard, Editor(s)

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