Share Email Print

Proceedings Paper

Review: fine embossing of novel glasses for photonic integrated circuits
Author(s): A. B. Seddon; D. Furniss; W. J. Pan; P. Sewell; A. Loni; Y. Zhang; T. M. Benson
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (Tg) and replicated; cooling below Tg freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 μm -scale replication is shown for chalcogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.

Paper Details

Date Published: 22 February 2008
PDF: 6 pages
Proc. SPIE 6890, Optical Components and Materials V, 689007 (22 February 2008); doi: 10.1117/12.760888
Show Author Affiliations
A. B. Seddon, Univ. of Nottingham (United Kingdom)
D. Furniss, Univ. of Nottingham (United Kingdom)
W. J. Pan, Univ. of Nottingham (United Kingdom)
P. Sewell, Univ. of Nottingham (United Kingdom)
A. Loni, Univ. of Nottingham (United Kingdom)
Y. Zhang, Univ. of Nottingham (United Kingdom)
T. M. Benson, Univ. of Nottingham (United Kingdom)

Published in SPIE Proceedings Vol. 6890:
Optical Components and Materials V
Michel J. F. Digonnet; Shibin Jiang; John W. Glesener; J. Christopher Dries, Editor(s)

© SPIE. Terms of Use
Back to Top