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Proceedings Paper

Shallow hole drilling with ultrashort pulse lasers
Author(s): B. R. Campbell; L. A. Forster; T. M. Lehecka; J. G. Thomas; V. V. Semak
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Paper Abstract

Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.

Paper Details

Date Published: 20 February 2008
PDF: 6 pages
Proc. SPIE 6879, Photon Processing in Microelectronics and Photonics VII, 68790J (20 February 2008); doi: 10.1117/12.760630
Show Author Affiliations
B. R. Campbell, Penn State Electro-Optics Ctr. (United States)
L. A. Forster, Penn State Electro-Optics Ctr. (United States)
T. M. Lehecka, Penn State Electro-Optics Ctr. (United States)
J. G. Thomas, Penn State Electro-Optics Ctr. (United States)
V. V. Semak, Penn State Electro-Optics Ctr. (United States)


Published in SPIE Proceedings Vol. 6879:
Photon Processing in Microelectronics and Photonics VII
David B. Geohegan; Frank Träger; Jan J. Dubowski; Andrew S. Holmes; Michel Meunier; Craig B. Arnold; Hiroyuki Niino, Editor(s)

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