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Proceedings Paper

Thermal analysis of high power GaN-based light emitting diode
Author(s): Debo Guo; Libin Wang; Zhiqiang Liu; Meng Liang; Manning Fan; Guohong Wang; Liangchen Wang; Jinmin Li
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Paper Abstract

In this paper we present thermal analysis of three different-structured high power LEDs. The thermal resistance of different-structured LEDs was determined. The results indicated that the thermal resistance severely depended on the number of bumps for flip-chip LEDs. One could get lower thermal resistance for flip-chip LEDs than that for conventional and vertical LEDs by selecting appropriate number of bumps in theory. But considering the practical process of LEDs' fabrication, the conventional LEDs because of the simple making process showed more stable and lower thermal resistance. There existed the same problems as flip-chip LEDs' for vertical LEDs. Maybe electroplate copper was the effective way to get good thermal characteristic.

Paper Details

Date Published: 4 January 2008
PDF: 5 pages
Proc. SPIE 6841, Solid State Lighting and Solar Energy Technologies, 68410Z (4 January 2008); doi: 10.1117/12.760019
Show Author Affiliations
Debo Guo, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)
Libin Wang, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)
Zhiqiang Liu, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)
Meng Liang, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)
Manning Fan, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)
Guohong Wang, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)
Liangchen Wang, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)
Jinmin Li, Engineering Research Ctr. for Semiconductor Lighting (China)
Institute of Semiconductors (China)


Published in SPIE Proceedings Vol. 6841:
Solid State Lighting and Solar Energy Technologies
Jinmin Li; Ling Wu; Yubo Fan; Yong-Hang Zhang; Michael E. Coltrin; Yuwen Zhao; Nuofu Chen; Vladimir M. Andreev; Jai Singh, Editor(s)

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