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Proceedings Paper

Development of nondestructive testing/evaluation methodology for MEMS
Author(s): James L. Zunino III; Donald R. Skelton; Ryan T. Marinis; Adam R. Klempner; Peter Hefti; Ryszard J. Pryputniewicz
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Paper Abstract

Development of MEMS constitutes one of the most challenging tasks in today's micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional characteristics of MEMS to enable refinement and optimization of their designs as well as for demonstration of their reliability. Until recently, this characterization was hindered by lack of a readily available methodology. However, using recent advances in photonics, electronics, and computer technology, it was possible to develop a NonDestructive Testing (NDT) methodology suitable for evaluation of MEMS. In this paper, an optoelectronic methodology for NDT of MEMS is described and its application is illustrated with representative examples; this description represents work in progress and the results are preliminary. This methodology provides quantitative full-field-of-view measurements in near real-time with high spatial resolution and nanometer accuracy. By quantitatively characterizing performance of MEMS, under different vibration, thermal, and other operating conditions, specific suggestions for their improvements can be made. Then, using the methodology, we can verify the effects of these improvements. In this way, we can develop better understanding of functional characteristics of MEMS, which will ensure that they are operated at optimum performance, are durable, and are reliable.

Paper Details

Date Published: 18 February 2008
PDF: 12 pages
Proc. SPIE 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, 688407 (18 February 2008); doi: 10.1117/12.759659
Show Author Affiliations
James L. Zunino III, U.S. Army RDE Command (United States)
Donald R. Skelton, U.S. Army RDE Command (United States)
Ryan T. Marinis, Worcester Polytechnic Institute (United States)
Adam R. Klempner, Worcester Polytechnic Institute (United States)
Peter Hefti, Worcester Polytechnic Institute (United States)
Ryszard J. Pryputniewicz, Worcester Polytechnic Institute (United States)

Published in SPIE Proceedings Vol. 6884:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
Allyson L. Hartzell; Rajeshuni Ramesham, Editor(s)

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