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Proceedings Paper

Electromagnetic micro-actuators, micro-motors, and micro-robots
Author(s): M. Feldmann; A. Waldschik; S. Büttgenbach
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Paper Abstract

Due to the development of new technologies, more and more complex MEMS applications can be realized. Especially electromagnetic micro actuators have reached a growing interest in micro technology in addition to commercial applications during the last years. Their basic construction exists of electric conductors and coil systems as well as of soft-magnetic and/or hard-magnetic materials that were fabricated in additive technology via UV-depth lithography and electroplating. For UV-depth lithography, photo resists like Epon SU-8, AZ9260, Intervia-3D-N and CAR44 were applied and optimized. Layer thickness up to 1 mm and aspect ratios over 60 were achieved. Special micro composites were developed. This allowed the fabrication of micro magnets with arbitrary shape and properties, revealing a complete compatibility to existing process chains. With these potential technologies, several complex 3-D micro actuators like micro motors and micro robots were developed and successfully tested. These developments include in detail: linear and rotatory reluctance micro stepper motors with compensated attraction force as well as a special "Lorentz force actuator", which was used for micro robots and micro motors. The micro robots were deployed for assembling and for micro-/nano positioning. Furthermore "plunger coil actuators" were realized based on a voice coil principle, which were used e.g. for a micro switch or a micro mirror. Moreover, rotatory synchronous motors were developed and successfully tested. All these devices have been realized by outstanding fabrication technologies and can be used for a wide range of applications.

Paper Details

Date Published: 21 December 2007
PDF: 10 pages
Proc. SPIE 6798, Microelectronics: Design, Technology, and Packaging III, 679811 (21 December 2007); doi: 10.1117/12.759482
Show Author Affiliations
M. Feldmann, Technical Univ. of Braunschweig (Germany)
A. Waldschik, Technical Univ. of Braunschweig (Germany)
S. Büttgenbach, Technical Univ. of Braunschweig (Germany)


Published in SPIE Proceedings Vol. 6798:
Microelectronics: Design, Technology, and Packaging III
Alex J. Hariz; Vijay K. Varadan, Editor(s)

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