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Proceedings Paper

Reliability evaluation for solder joints in embedded electronic package
Author(s): Masashi Yamabe; Qiang Yu; Tadahiro Shibutani; Hiroki Miyauchi; Masaki Shiratori; Hideki Ohhashi
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Paper Abstract

When the design engineers discuss the new concept of the embedded electronic packaging, there are a lot of kinds of materials on the list, the resins, silicones, and so on. Therefore, it is very important to study and understand the basic effect of the new materials on the important components of their products at the early stage. In the study, the authors used simulation approach to investigate several different concepts of the embed package, and the focus is the effect of the important components. Based upon the analytical results, the advantage and demerit of each concept were discussed.

Paper Details

Date Published: 21 December 2007
PDF: 10 pages
Proc. SPIE 6798, Microelectronics: Design, Technology, and Packaging III, 67980S (21 December 2007); doi: 10.1117/12.759410
Show Author Affiliations
Masashi Yamabe, Yokohama National Univ. (Japan)
Qiang Yu, Yokohama National Univ. (Japan)
Tadahiro Shibutani, Yokohama National Univ. (Japan)
Hiroki Miyauchi, Yokohama National Univ. (Japan)
Masaki Shiratori, Yokohama National Univ. (Japan)
Hideki Ohhashi, Nokia Japan Co. Ltd. (Japan)

Published in SPIE Proceedings Vol. 6798:
Microelectronics: Design, Technology, and Packaging III
Alex J. Hariz; Vijay K. Varadan, Editor(s)

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