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Proceedings Paper

Measurements of silicon dry-etching rates and profiles in MEMS foundries and their application to MEMS design software
Author(s): T. Takano; T. Ikehara; R. Maeda
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Paper Abstract

Deep reactive ion etching (DRIE) is an important tool in MEMS fabrication to achieve three-dimensional structures. However, the etching profiles are not yet perfect. We had etching test samples fabricated in three MEMS foundries and measured the etching rates, sidewall angles, mask selectivity, and sidewall roughness against the line and space of 2 to 5000 μm. We also performed similar DRIE processes using our system and compared our samples and the samples from the foundries. The measurement results revealed the typical fabrication results in the MEMS foundries and their differences. The data were included in the database of MemsONE, a newly developed MEMS design software, and can be used for the process emulations.

Paper Details

Date Published: 9 January 2008
PDF: 8 pages
Proc. SPIE 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV, 68001X (9 January 2008); doi: 10.1117/12.759374
Show Author Affiliations
T. Takano, National Institute of Advanced Industrial Science and Technology (Japan)
T. Ikehara, National Institute of Advanced Industrial Science and Technology (Japan)
R. Maeda, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 6800:
Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV
Hark Hoe Tan; Jung-Chih Chiao; Lorenzo Faraone; Chennupati Jagadish; Jim Williams; Alan R. Wilson, Editor(s)

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