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Proceedings Paper

Fabrication of smooth 45° micromirror using TMAH low concentration solution with NCW-601A surfactant on <100> silicon
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Paper Abstract

Paper reports improved results in the fabrication of 45° micromirrors using low concentration of TMAH with NCW-601A surfactant. 45° micro mirror is an essential component for obtaining 90° out-of-plane reflection of the optical beam. TMAH anisotropic wet etching on (100) silicon wafer with features aligned to the flat so that 45° slope is formed on (110) plane. This requires the etch rate of <110> planes to be lower than <100> planes. Etching rate selectivity depends on: temperature, concentration, and additives. Substantial undercutting of mask needs to be taken into consideration during the design. TMAH concentrations ranging from 2.5% to 10% with different concentrations of surfactant have been studied to achieve improved smoothness of the micromirror surface and better selectivity. SEM/AFM measurement show the roughness of mirror is less than 1nm. Results also show that the surface roughness varies along the 45° slope with the roughest portion at the top of the mirror. This paper will describe the techniques to reduce the size of the rough portion of the mirror.

Paper Details

Date Published: 9 January 2008
PDF: 9 pages
Proc. SPIE 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV, 68001W (9 January 2008); doi: 10.1117/12.759343
Show Author Affiliations
Yi Wei Xu, Univ. of New South Wales (Australia)
Aron Michael, Univ. of New South Wales (Australia)
Chee Yee Kwok, Univ. of New South Wales (Australia)


Published in SPIE Proceedings Vol. 6800:
Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV
Hark Hoe Tan; Jung-Chih Chiao; Lorenzo Faraone; Chennupati Jagadish; Jim Williams; Alan R. Wilson, Editor(s)

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