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Proceedings Paper

Novel MEMS-based thermometer with low power consumption for health-monitoring network application
Author(s): Y. Zhang; T. Ikehara; J. Lu; T. Kobayashi; M. Ichiki; T. Itoh; R. Maeda
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Paper Abstract

We proposed one novel MEMS-based thermometer with low power-consumption for animal/human health-monitoring network application. The novel MEMS-based thermometer was consisted of triple-beam bimorph arrays so that it could work in a continuous temperature range. Neither continuous electric supply nor A/D converter interface is required by the novel thermometer owing to the well-known deflection of bimaterials cantilever upon temperature changes. The triple-beam structure also facilitated the novel thermometer with excellent fabrication feasibility by conventional microfabrication technology. The parameters of the triple-beam bimorph arrays were determined by finite element analysis with ANSYS program. Low stress Au and Mo metal films were used as top and bottom layer, respectively. The deflection of the triple-beam bimorphs were measured on a home-made heating stage by a confocal scanning laser microscopy. The novel bimorphs had temperature responses similar to traditional single-beam bimorphs. Initial bend of the prepared triple-beam bimorphs were dominantly determined by their side beams. The sensitivity of the novel thermometer was as high as 0.1°C. Experimental results showed that the novel thermometer is attractive for network sensing applications where the power capacity is limited.

Paper Details

Date Published: 9 January 2008
PDF: 10 pages
Proc. SPIE 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV, 68001V (9 January 2008); doi: 10.1117/12.759296
Show Author Affiliations
Y. Zhang, National Institute of Advanced Industrial Science and Technology (Japan)
T. Ikehara, National Institute of Advanced Industrial Science and Technology (Japan)
J. Lu, National Institute of Advanced Industrial Science and Technology (Japan)
T. Kobayashi, National Institute of Advanced Industrial Science and Technology (Japan)
M. Ichiki, National Institute of Advanced Industrial Science and Technology (Japan)
T. Itoh, National Institute of Advanced Industrial Science and Technology (Japan)
R. Maeda, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 6800:
Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV
Hark Hoe Tan; Jung-Chih Chiao; Lorenzo Faraone; Chennupati Jagadish; Jim Williams; Alan R. Wilson, Editor(s)

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