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Proceedings Paper

Thermal analysis of wafer-level LED packages with multichips
Author(s): Jae-Wan Choi; Jeung-Mo Kang; Jae-Wook Kim; Jeong-Hyeon Choi; Du-Hyun Kim; Geun-Ho Kim; Yong-Seon Song; Yu-Ho Won; Jeong-Soo Lee
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Paper Abstract

Thermal analysis of wafer-level packaged LEDs with red, green and blue multi-chips are investigated. With Si-MEMS technology, wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process. In this paper, thermal characteristics of wafer-level packaged white LEDs with multi-chips are investigated using both serial and matrix measurement methods.

Paper Details

Date Published: 26 September 2007
PDF: 7 pages
Proc. SPIE 6797, Manufacturing LEDs for Lighting and Displays, 67970R (26 September 2007); doi: 10.1117/12.758825
Show Author Affiliations
Jae-Wan Choi, LG Electronics Institute of Technology (South Korea)
Jeung-Mo Kang, LG Electronics Institute of Technology (South Korea)
Jae-Wook Kim, LG Electronics Institute of Technology (South Korea)
Jeong-Hyeon Choi, LG Electronics Institute of Technology (South Korea)
Du-Hyun Kim, LG Electronics Institute of Technology (South Korea)
Geun-Ho Kim, LG Electronics Institute of Technology (South Korea)
Yong-Seon Song, LG Electronics Institute of Technology (South Korea)
Yu-Ho Won, LG Electronics Institute of Technology (South Korea)
Jeong-Soo Lee, LG Electronics Institute of Technology (South Korea)


Published in SPIE Proceedings Vol. 6797:
Manufacturing LEDs for Lighting and Displays

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