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Proceedings Paper

Study of uncooled thermal imaging system with multiple working temperatures
Author(s): Junju Zhang; Tian Si; Lianjun Sun; Benkang Chang; Yunsheng Qian; Yafeng Qiu
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Paper Abstract

Reasons that thermal imaging systems consume power have been analyzed, and a low-power design scheme of thermal imaging systems has been presented with multiple working temperature points. Transient response performance of α-si microbolometer detectors is simulated firstly when the working temperature varies in the range from -40°C to +60°C. Simulating results show that α-si microbolometer detectors have coherent response performance in a large range of working temperature, which lay basis for designing uncooled thermal imaging system with multiple working temperatures. Different from traditional thermal imaging systems, this thermal imaging system has three working temperature with an accuracy range of less than ±0.01°C. When working, the temperature control circuit will switch between the working temperatures according to the variety of the environmental temperature. To evaluate this thermal imaging system, we measure its power consumption and NETD in the environmental temperature range from -40°C to +60°C. The measurement results are that the total power is less than 2500mW and the NETD is less than 120mk. This indicates that the thermal imaging system has nearly the same imaging quality and obviously lower power, compared with traditional thermal imaging systems.

Paper Details

Date Published: 23 January 2008
PDF: 8 pages
Proc. SPIE 6835, Infrared Materials, Devices, and Applications, 683520 (23 January 2008); doi: 10.1117/12.758391
Show Author Affiliations
Junju Zhang, Nanjing Univ. of Science and Technology (China)
Tian Si, Nanjing Univ. of Science and Technology (China)
Lianjun Sun, Nanjing Univ. of Science and Technology (China)
Benkang Chang, Nanjing Univ. of Science and Technology (China)
Yunsheng Qian, Nanjing Univ. of Science and Technology (China)
Yafeng Qiu, Nanjing Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 6835:
Infrared Materials, Devices, and Applications
Yi Cai; Haimei Gong; Jean-Pierre Chatard, Editor(s)

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