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Proceedings Paper

Stable and high-efficiency optical transmitter using a VCSEL-direct-bonded connection block
Author(s): Do-Won Kim; Tae-Woo Lee; Mu Hee Cho; Hyo-Hoon Park
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Paper Abstract

A stable and high-efficiency optical transmitter module was fabricated for optical printed circuit board (OPCB) based interconnections. A bottom-emitting VCSEL was directly bonded on a 90°-bent fiber connection block. Since this transmitter module does not have free space between the VCSEL and the connection block, it reduces the optical losses due to the scattering and beam divergence at the interface between the VCSEL and the connection block. A ray trace simulation for the optical loss supports the conclusion that closer contact of VCSEL to the connection block can provide higher coupling efficiency by eliminating the optical losses induced by the Fresnel reflection and the beam divergence. The index matching fluid treatment between the VCSEL and the connection block improves the coupling efficiency especially in the longitudinal direction. This trend was experimentally identified. Effective heat discharge through the contacted connector in this module improves significantly the power characteristics of the VCSEL. The L-I-V curves demonstrate that the fabricated VCSEL module shows higher optical powers than the bare VCSEL improving from +0.3 dB to +3.3 dB. Successful eye diagram at the speed of 5 Gb/s/ch with 850 nm was obtained. The bit error rate was 10-9 at the speed of 5 Gb/s/ch, and it became lower than 10-12 at the speed below 3 Gb/s/ch.

Paper Details

Date Published: 8 February 2008
PDF: 8 pages
Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689916 (8 February 2008); doi: 10.1117/12.758257
Show Author Affiliations
Do-Won Kim, Information and Communications Univ. (South Korea)
Tae-Woo Lee, Information and Communications Univ. (South Korea)
Mu Hee Cho, Information and Communications Univ. (South Korea)
Hyo-Hoon Park, Information and Communications Univ. (South Korea)


Published in SPIE Proceedings Vol. 6899:
Photonics Packaging, Integration, and Interconnects VIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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