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Proceedings Paper

Preparation and property study of gold-tin alloys for packaging of high-power semiconductor lasers
Author(s): Bo Huang; Jinqiang Chen; Zhongliang Qiao; Chunling Liu; YanPing Yao; Xin Gao; Baoxue Bo
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Paper Abstract

A novel fabrication method and process of Au(80wt.%)-Sn(20wt.%) eutectic alloys solder with excellent thermal, electrical and mechanical properties and relatively low melting and reflow temperature was presented, the characteristic of gold-tin alloy solder and the key technique to realize highly reliable bonding were discussed.

Paper Details

Date Published: 7 January 2008
PDF: 7 pages
Proc. SPIE 6824, Semiconductor Lasers and Applications III, 68241E (7 January 2008); doi: 10.1117/12.756839
Show Author Affiliations
Bo Huang, Changchun Univ. of Science and Technology (China)
Jinqiang Chen, Changchun Univ. of Science and Technology (China)
Zhongliang Qiao, Changchun Univ. of Science and Technology (China)
Chunling Liu, Changchun Univ. of Science and Technology (China)
YanPing Yao, Changchun Univ. of Science and Technology (China)
Xin Gao, Changchun Univ. of Science and Technology (China)
Baoxue Bo, Changchun Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 6824:
Semiconductor Lasers and Applications III
Lianghui Chen; Hiroyuki Suzuki; Paul T. Rudy; Ninghua Zhu, Editor(s)

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