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Proceedings Paper

The design of a new concavity heat sink for the high power semiconductor laser array
Author(s): Hong-Dong Zhao; Mei Sun; Hong-Li Tian; Jin-Qin Wang
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Paper Abstract

In this paper, we will present the new structure of the concavity heat sink with flower water in the pipe for semiconductor laser array. In the CW operation, the main equations of controlling temperature and boundary conditions are described in the concavity heat sink. The static thermal conduction equation that govern heat flow in the high power laser array and the heat sink is given. The variational equation integral of equation has been described according the boundary conditions based on Finite Element Method. The process of solving the equation is included and the distribution of temperature in the concavity heat sink is studied. The virtues of concavity heat sink comparing with the rectangle heat sink are showed. We also design the thickness of the concavity heat sink. The difference of the concavity heat sink and the rectangle heat sink will be presented. The result shows that the maximum temperature in the heat sink and the temperature grads especially in the corner of heat sink are dropped and this heat sink is best fit for the heat leaving off the laser array.

Paper Details

Date Published: 7 January 2008
PDF: 6 pages
Proc. SPIE 6824, Semiconductor Lasers and Applications III, 68241C (7 January 2008); doi: 10.1117/12.756649
Show Author Affiliations
Hong-Dong Zhao, Hebei Univ. of Technology (China)
Mei Sun, Hebei Univ. of Technology (China)
Hong-Li Tian, Hebei Univ. of Technology (China)
Jin-Qin Wang, Hebei Univ. of Technology (China)


Published in SPIE Proceedings Vol. 6824:
Semiconductor Lasers and Applications III
Lianghui Chen; Hiroyuki Suzuki; Paul T. Rudy; Ninghua Zhu, Editor(s)

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