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Proceedings Paper

New approach for 1w high output LED package using 3D lead frame
Author(s): Zihua Liu
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Paper Abstract

Currently, to package high power white LED almost use the manner of coating Phosphor over 40mil blue chip, in order to reduce heat dissipation, a new solution was brought about How to integrate small dies to achieve large die effect? This report will bring up a new manner to bond chips in vertical surface, break the traditionary packing manner.

Paper Details

Date Published: 15 January 2008
PDF: 7 pages
Proc. SPIE 6841, Solid State Lighting and Solar Energy Technologies, 68410R (15 January 2008); doi: 10.1117/12.756339
Show Author Affiliations
Zihua Liu, Golden Valley Optoelectronics Co., Ltd. (China)

Published in SPIE Proceedings Vol. 6841:
Solid State Lighting and Solar Energy Technologies
Jinmin Li; Yuwen Zhao; Nuofu Chen; Ling Wu; Yubo Fan; Vladimir M. Andreev; Yong-Hang Zhang; Jai Singh; Michael E. Coltrin, Editor(s)

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