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Proceedings Paper

Contrastive study on the mechanical performance of MEMS microsprings fabricated by LIGA and UV-LIGA technology
Author(s): Hua Li; Gengchen Shi
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Paper Abstract

With good mechanical performance and mature fabrication technology of LIGA and UV-LIGA, Ni is chosen as the material of S style MEMS microspring. At 24°C and 25% relative humidity, five different points in LIGA Ni sample were tested with the MICRO HARDNESS TESTER, and the Young's modulus was 219GPa. From the tensile tests of UV-LIGA Ni sample the Young's modulus of UV-LIGA Ni is 180GPa. The S style microspring was fabricated by LIGA and UV-LIGA technology separately. Applying the Castigliano second theorem of energy method in macro theory, the spring constant formulas of S style microspring in three application modes were deduced, and the correctness was verified by the FEA (Finite Element Analysis) simulation. The experiments of S style microspring's deformation properties were carried out by the Tytron250 micro force test machine and a tensile measurement system separately. The experimental results agree with the theoretical analysis. Based on the above analysis, the change laws of microspring's spring coefficient in different application patters are summarized.

Paper Details

Date Published: 4 January 2008
PDF: 10 pages
Proc. SPIE 6836, MEMS/MOEMS Technologies and Applications III, 68360E (4 January 2008); doi: 10.1117/12.756048
Show Author Affiliations
Hua Li, Tsinghua Univ. (China)
Beijing Institute of Technology (China)
Gengchen Shi, Beijing Institute of Technology (China)


Published in SPIE Proceedings Vol. 6836:
MEMS/MOEMS Technologies and Applications III
Jung-Chih Chiao; Xuyuan Chen; Zhaoying Zhou; Xinxin Li, Editor(s)

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